pb rohs ems21hhb-12.288m ems21 h h b -12.288m series rohs compliant (pb-free) 4 pad 3.2mm x 5mm smd 1.8vdc lvcmos mems spread spectrum oscillator frequency tolerance/stability 50ppm maximum over -40c to +85c output control function tri-state (disabled output high impedance) nominal frequency 12.288mhz spread spectrum 0.50% center spread electrical specifications nominal frequency 12.288mhz frequency tolerance/stability 50ppm maximum over -40c to +85c (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operating temperature range, supply voltage change, output load change, first year aging at 25c, 260c reflow, shock, and vibration) aging at 25c 1ppm maximum first year supply voltage 1.8vdc 5% maximum supply voltage -0.5vdc to +1.98vdc input current 25ma maximum (unloaded; nominal vdd) output voltage logic high (voh) 90% of vdd minimum (ioh=-8ma) output voltage logic low (vol) 10% of vdd maximum (iol=+8ma) rise/fall time 2nsec maximum (measured from 20% to 80% of waveform) duty cycle 50 5(%) (measured at 50% of waveform) load drive capability 15pf maximum output logic type cmos output control function tri-state (disabled output high impedance) tri-state input voltage (vih and vil) 70% of vdd minimum or no connection to enable output, 30% of vdd maximum to disable output disable current 20ma maximum (disabled output: high impedance) (pad 1=ground) spread spectrum 0.50% center spread modulation frequency 30khz minimum, 32khz typical, 35khz maximum period jitter 90psec maximum (cycle to cycle; spread spectrum-on; fo=133.333m, vdd=1.8vdc) start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications esd susceptibility mil-std-883, method 3015, class 2, hbm 2000v flammability ul94-v0 mechanical shock mil-std-883, method 2002, condition g, 30,000g moisture resistance mil-std-883, method 1004 moisture sensitivity level j-std-020, msl 1 resistance to soldering heat mil-std-202, method 210, condition k resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 (pads on bottom of package only) temperature cycling mil-std-883, method 1010, condition b thermal shock mil-std-883, method 1011, condition b vibration mil-std-883, method 2007, condition a, 20g www.ecliptek.com | specification subject to change without notice | rev d 3/12/2011 | page 1 of 5
ems21hhb-12.288m mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state (high impedance) 2 ground 3 output 4 supply voltage line marking 1 xxxx or xxxxx xxxx or xxxxx=ecliptek manufacturing lot code 1.04 0.60 1.60 (x4) 1.50 (x4) www.ecliptek.com | specification subject to change without notice | rev d 3/12/2011 | page 2 of 5 3.20 0.15 0.85 0.15 0.08 max 2.39 0.10 1.15 0.10 (x4) 1.20 0.10 (x4) 5.00 0.15 0.5 o max 0.80 0.15 2 1 3 4 r0.58 0.10 c0.35 0.10 all t oler ances are 0.1 sug g ested solder p ad la y out solder land (x4) all dimensions in millimeters
ems21hhb-12.288m www.ecliptek.com | specification subject to change without notice | rev d 3/12/2011 | page 3 of 5 output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% of w a v ef or m 50% of w a v ef or m 20% of w a v ef or m f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input supply v oltage (v dd ) t est cir cuit f or cmos output output t r i-state or p o w er do wn or spread disab le ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ems21hhb-12.288m high temperature infrared/convection ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 www.ecliptek.com | specification subject to change without notice | rev d 3/12/2011 | page 4 of 5
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods ems21hhb-12.288m low temperature infrared/convection 240c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 240c maximum target peak temperature (tp target) 240c maximum 1 time / 230c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times / 80 seconds maximum 1 time ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. www.ecliptek.com | specification subject to change without notice | rev d 3/12/2011 | page 5 of 5
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